Category: UX design
Category: Graphic design
Category: Graphic design software
Category: Product lifecycle management software
Category: CAD software
Category: Product lifecycle management software
Category: Product lifecycle management software
Category: Software suite1. Field of the Invention
The present invention relates to a wafer with an identification mark, and more particularly to a wafer with an identification mark by which the wafer with an identification mark can be controlled to apply an optimum process condition in a production line.
2. Description of the Related Art
A semiconductor device is a very important device for use in an electronic industry. Accordingly, various processes, such as an etching process for a thin film, a doping process and an ion implanting process for a semiconductor, are performed in the semiconductor device production line.
In the processes, wafers are continuously processed for mass production. Wafers are mainly selected according to a processing recipe to be processed.
However, when the wafer is processed, the performance of the wafer is not precisely maintained. The processing of the wafer may be influenced by processing condition, which is determined by processes and steps previously performed.
Therefore, the wafer should be controlled to apply an optimum process condition according to its own characteristics to provide the optimum performance of the wafer.
In the semiconductor device production process, wafers are processed as described above. However, the processing condition for each wafer is different because the wafers are processed in a batch and may have different characteristics because of a process condition and process recipe applied to the wafer.
Because the wafer performance is easily influenced by the previous processes, it is very difficult to make a process condition according to the wafer characteristics. Therefore, the wafer is not well controlled to apply an optimum process condition. As a result, the production yield of the semiconductor device is lowered.
Accordingly, the present invention is directed to a wafer with an identification mark for easily and effectively controlling the wafer to apply an optimum process condition.
To accomplish the above and other objectives, the wafer with an identification mark is provided. The wafer with an identification mark is composed of a wafer support member; an identification mark formed on the wafer support member; and an insulating layer surrounding the identification mark. The identification mark is formed by coating a tape on the wafer support member, by which the wafer with the identification mark can be controlled to apply an ac619d1d87
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